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Alcatel Micro Machining Systems, a leading supplier of deep silicon etching equipment for MEMS and 3D Semiconductors, today announced that it has shipped an Advanced DRIE production tool to Touch Micro-system Technology (tMt) to start production of MEMS devices including Micro-mirrors, Si-microphones and gyros.
Touch Micro-system Technology (tMt) in Yang-Mei, Taoyuan, Taiwan is a pure MEMS foundry. The company is acting as a developer and manufacturer of MEMS components and modules and is one of the few 200 mm Si-based MEMS/CMOS technology providers.
“We worked with experienced process specialists during the tool evaluation phase and the quality of the process results, the tool field proven reliability tracks and the professional service support both at global and local level made us very comfortable working together in a three shifts production operation”, said Dr C.Y. MA President and CEO, at Touch Micro-system Technology
“We are very satisfied to be selected by a leading MEMS foundry in Taiwan. High etch rate leading to high throughput combined with a newly qualified end point detection method were the criteria to meet for the win”, said Jean-Marc Gruffat, Director of Products for Alcatel Micro Machining Systems.
Alcatel has recently launched its new AMS 3200 / AMS 4200 cluster tools providing the most recent process capabilities in DRIE for etching Silicon materials and Glass like materials as well as PECVD solutions for SiO2 and Si3N4 isolation layers. Wafer Handling modules are based on BROOKS field proven stations. Process Modules are equipped with a high density, low pressure Alcatel patented ICP plasma source for Bosch DRIE Silicon Etching, and Etching of deep SiO2, Quartz, Fused silica, Boro-silicate and Glass, and PECVD deposition of SiO2 and Si3N4 at room temperature.
The AMS 3200 and AMS 4200 DRIE multi-chamber platforms are dedicated to pilot lines and mass volume production in the field of MEMS and 3D Semiconductors for applications like Accelerometers, Silicon Microphones, RF MEMS, Ink Jet Printer Heads, Tyre Pressure Monitoring Systems or 3D Interconnections, 3D Imaging Sensors, 3D Power Devices.
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